HomeNewsHuawei to Manufacture and Release the Kirin 820 SoC

Huawei to Manufacture and Release the Kirin 820 SoC

After releasing the Kirin 810 processor the previous year, Huawei is allegedly developing the next chipset, named Kirin 820, which is believed to launch in the first part of this year. The 6nm processor is probably going to support all the mid-range 5G smartphones, as GizmoChina reports.

As per a new report, the Chinese technology giant is working on this chipset utilizing Samsung‘s architecture, and the new technology can enhance density up to 18 percent. The paper also says that the 6nm chipset will provide much better performance than Qualcomm and MediaTek processors. They will most probably pack Cortex A77 architecture and will offer the dual-mode feature for all 5G networks, according to the report. It will also be possible that the Nova 7 and the Honor 10x devices will pack the Kirin 820 processor.

The company will start manufacturing these chipsets in the second quarter of 2020, and there are chances that by the end of it, the tech giant will release them. Even so, there is no official confirmation regarding this from the company itself.

Huawei Nova 6SE Features Kirin 820’s Predecessor

The forthcoming processor will be the successor of the Kirin 810 SoC, used in the company’s newly-released Nova 6SE mobile phone. Huawei has released the smartphone in China in December of 2019, and it put an approximate $315 price on it.

The Nova 6SE packs a 6.4-inch IPS display, with 1080 x 2310 resolution. It comes with 8GB of RAM and 128GB of internal storage, with the possibility to expand the storage as it features a nano SD card slot.
Regarding the camera settings, the Huawei Nova 6SE has a quad-camera array, which includes a 16 MP main camera, an 8 MP ultra-wide lens, 2 MP macro lens, and a 2 MP depth assist sensor. In the front, there is a 16 MP selfie camera.

The Huawei Nova 6SE is powered by Android 10. It also packs a fingerprint sensor and has a 4,200 mAh battery that supports 40W fast-charging.


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